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September 15, 2015
Invited presentation of Elmar Platzgummer / CEO at SEMICON Taiwan

Advanced Technologies in Accelerating Digital Era and IoT Forum, Electron Multi-Beam Technology for Mask and Wafer Direct Write


September 3, 2013
IMS Nanofabrication announces Partnership with JEOL

IMS NANOFABRICATION ANNOUNCES PARTNERSHIP WITH JEOL
FOR THE REALIZATION OF ALPHA AND BETA ELECTRON MULTI-BEAM MASK WRITER (MBMW) TOOLS

VIENNA–(BUSINESS WIRE)–IMS Nanofabrication AG announced today that a partnership was formed with JEOL Ltd. for the realization of Alpha and Beta electron multi-beam mask writer (MBMW) tools for the 10nm half-pitch mask technology node. For this purpose IMS Nanofabrication has developed and demonstrated a multi-beam write engine providing 262-thousand programmable beams of 50keV energy. JEOL provides a novel platform with an air-bearing vacuum stage for writing most advanced patterns on 6-inch mask blanks. The MBMW Alpha tool will be realized in 2014, and will form the basis for two consecutive MBMW Beta tools which will be built for the MBMW Collaboration formed by IMS with DNP, Intel, Photronics and TSMC.
“We are very pleased with this partnership, as it will ensure timely completion of the Alpha and Beta tools, paving the way towards the production of HVM tools”, said Elmar Platzgummer, CEO of IMS Nanofabrication.
“This partnership reinforces JEOL’s position in the leading-edge mask writer market with a highly competitive technology. JEOL is proud to contribute a newly developed multi-generational platform with an air-bearing stage as a vital part of the tool”, said Yasutoshi Nakagawa, Corporate Officer, General Manager of SE Business Unit, JEOL Ltd.

About IMS

IMS Nanofabrication AG (“IMS”) is an Austrian based high-tech company that was founded in December 2006 through the merger of the former IMS Nanofabrication GmbH and IMS – Ionen Mikrofabrikations Systeme GmbH. Based on its extensive know-how in charged particle systems, IMS offers solutions to directly transfer custom designed patterns to resist or to generate resist-less two and three dimensional surface modifications with features below 20 nanometers. IMS focuses its efforts on the development and production of key tool components for mask writing and direct write lithography applications. It plans to commercialize its technology and related services in cooperation with strategic investors and partners involved in the mask and lithography ecosystem.

About JEOL Ltd.           

JEOL Ltd. is a world leader in electron optical equipment and instrumentation for high-end scientific and industrial research and development. Core product groups include electron microscope s (SEMs and TEMs), instruments for the semiconductor industry (electron beam lithography and a series of defect review and inspection tools), and analytical instruments including mass spectrometers, NMRs and ESRs. For more information on JEOL Ltd. visit: www.jeol.co.jp/en/

Contacts:
IMS Nanofabrication AG
Dr. Hans Loeschner
+43 699 123 67 223
e-mail: hans.loeschner@www.ims.co.at

JEOL Ltd.
Hirokazu Yamada
VP Technical Marketing
phone: +81-42-528-3491
fax: +81-42-528-3488
e-mail: hiyamada@jeol.co.jp


January 9, 2013
Keynote presentation of Elmar Platzgummer / CEO at SPIE: Mo, Feb 25, 2013

Elmar Platzgummer, CEO of IMS Nanofabrication AG, is invited to present the keynote “Electron multibeam technology for mask and wafer writing” at the SPIE Advanced Lithography international conference, taking place February 24-28, 2013 in San Jose, California, USA. The Monday, February 25 keynote is part of Session 1 of the Conference “Alternative Lithographic Technologies V” [paper 8680-3].

Electron multi-beam technology for mask and wafer writing

Elmar Platzgummer

IMS Nanofabrication AG
Schreygasse 3, Vienna, A-1020 Austria
e-mail: elmar.platzgummer@www.ims.co.at

We realized a proof-of-concept (POC) tool confirming writing principles and lithography performance capability. The new architecture will be introduced for mask writing at first, but has also the potential for 1xmask and direct wafer writing. The POC system achieves the predicted 5nm 1sigma blur across the array of 512 x 512 programmable 20nm beams. 24nm HP has been demonstrated and complex patterns have been written in scanning stripe exposure mode. The first production worthy system for the 11nm HP mask node is scheduled for 2014. Implementing a multi-axis column configuration, 50x/100x productivity enhancement is possible for direct 300/450mm wafer writing.

[SPIE 2013]

[Abstracts PDF]

[corresponding publication: link]


August 24, 2012
TSMC joins Multi-Beam Mask Writer Collaboration with DNP, INTEL & PHOTRONICS

IMS NANOFABRICATION ANNOUNCES PARTICIPATION OF TSMC IN THE ELECTRON MULTI-BEAM MASK WRITER COLLABORATION JOINING FOUNDING MEMBERS
DNP, INTEL, AND PHOTRONICS

VIENNA, AUSTRIA (AUGUST 24, 2012) – IMS Nanofabrication AG (IMS) announced today that Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) has joined IMS’ multibeam mask writer development collaboration, adding its support to that of collaboration founding members Dai Nippon Printing Co., Ltd. (DNP), Intel Corporation and Photronics Inc. The purpose of the collaborative program is to develop an electron multi-beam mask writer for use in advanced mask lithography applications with the goal of meeting lithography specifications below 10nm while achieving high throughput requirements. The program is nearing the completion of a proof-of-concept phase, and the upcoming phase of the collaboration will focus on the design and construction of an alpha and beta version of the multi-beam mask writer.
“The newly started development of alpha and beta electron multi-beam mask writer tools is strongly supported by TSMC joining the collaboration with DNP, Intel, and Photronics,” said Elmar Platzgummer, CEO / CTO of IMS.
C.S. Yoo, head of E-Beam Operation (EBO) at TSMC said: “We are pleased to work with IMS and other partners in the industry on this multi-beam mask writer project. We are very encouraged by this partnership’s goal of producing a mask writer with both accuracy and high productivity around 2015 for nodes beyond 10 nanometers. This project shows great potential for producing that breakthrough.”

The founding members welcome the addition of TSMC and believe that the collaboration demonstrates solid industry support from both merchant mask makers and captive mask shops. IMS believes that by enlisting customers early in the development phase, the design and operation of this new architecture will readily adapt to the needs of a high volume manufacturing environment. The collaboration participants will provide input to IMS on mask manufacturing issues that are critical to leading-edge device manufacturers and to leading merchant mask makers. Collaboration members expect to benefit from early access to the electron mask exposure tool (eMET) technology and from the commercialization of the technology in partnership with additional industry players. This collaboration is representative of a new approach to managing development programs that are needed to address critical demands in mask making.

About DNP

DNP is one of the world’s largest comprehensive printing companies. DNP’s wide range of businesses include publication printing, commercial printing, smart cards, business forms, network business and electronic components, among others. Its products in the electronics field include color filters and other components for LCDs, photomasks, PCBs and semiconductor-related components. In the photomask market DNP is a world leader, utilizing its time honored printing techniques and know-how in the fabrication of cutting- edge photomasks. For more information on DNP, please visit: www.dnp.co.jp

About IMS

IMS Nanofabrication AG (“IMS”) is an Austrian based high-tech company that was founded in December 2006 through the merger of the former IMS Nanofabrication GmbH and IMS – Ionen Mikrofabrikations Systeme GmbH. Based on its extensive know-how in charged particle systems, IMS offers solutions to directly transfer custom designed patterns to resist or to generate resist-less two and three dimensional surface modifications with features below 20 nanometers. IMS focuses its efforts on the development and production of key tool components for mask writing and direct write lithography applications. It plans to commercialize its technology and related services in cooperation with the strategic investors participating in this funding round and with other parties involved in the mask and lithography ecosystem.

About Intel

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com
Intel is a trademark of Intel Corporation in the United States and other countries.

About Photronics

Photronics Inc. is a leading worldwide manufacturer of photomasks. Photomasks are high precision quartz plates that contain microscopic images of electronic circuits. A key element in the manufacture of semiconductors and flat panel displays, photomasks are used to transfer circuit patterns onto semiconductor wafers and flat panel substrates during the fabrication of integrated circuits, a variety of flat panel displays and, to a lesser extent, other types of electrical and optical components. They are produced in accordance with product designs provided by customers at strategically located manufacturing facilities in Asia, Europe, and North America. Additional information on the Company can be accessed at: www.photronics.com

About TSMC

Established in 1987, TSMC is the world’s first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and “More-than-Moore” wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment’s leading technologies and TSMC COMPATIBLE® design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality. Additional information on the Company can be accessed at: www.tsmc.com

Contact:
IMS Nanofabrication AG
Dr. Hans Loeschner
+43 699 123 67 223
e-mail: hans.loeschner@www.ims.co.at


January 23, 2012
Mask Writer Collaboration with DNP, INTEL and PHOTRONICS


IMS NANOFABRICATION ANNOUNCES ELECTRON MULTI-BEAM

MASK WRITER COLLABORATION WITH DNP, INTEL AND PHOTRONICS


VIENNA, AUSTRIA (JANUARY 23, 2012) – IMS Nanofabrication AG (IMS) announced today that Dai Nippon Printing Co., Ltd. (DNP), Intel Corporation, Photronics Inc. and IMS are commencing a joint electron multi-beam mask writer tool collaboration to advance development of IMS’ electron multi-beam projection technology. The engagement of DNP, a leading merchant photomask supplier to the electronics industry, augments the recent equity funding round announced by IMS that included participation from Intel and Photronics.
“We are pleased with the support being provided by DNP, Intel and Photronics as we work to develop our electron mask exposure tool (eMET) technology for sub 22nm mask writing applications,” said Max Bayerl, CEO of IMS.
Naoya Hayashi, Research Fellow, Electronic Device Operations, DNP said, “We believe the development of IMS Nanofabrication’s Multi-Beam Technology through the mutual global collaboration is quite significant as the next generation high efficient pattern writing platform.”
“Intel is encouraged by the lithography capability demonstrated to date by IMS,” said Chiang Yang, Vice President and General Manager of Intel Mask Operations (IMO). “We believe that industry collaboration to develop promising photomask technologies leads to robust solutions that are critical to help extend Moore’s Law.”
DNP, Intel and Photronics are the first industry participants to sign the technology collaboration agreement with IMS to support its eMET development program. Collaboration participants will provide input to IMS on mask manufacturing issues that are critical to leading-edge device manufacturers and to leading merchant mask makers. The participants expect to benefit from early access to the eMET technology and from eventual commercialization of the technology in partnership with additional industry players.
Christopher Progler, Chief Technology Officer, Photronics, said, “Formation of this collaboration is a timely and very positive step forward as IMS continues to build momentum toward commercialization of their multi-beam column. Photronics looks forward to strong participation as technology collaborator on this critical program.”

About DNP

DNP is one of the world’s largest comprehensive printing companies. DNP’s wide range of businesses include publication printing, commercial printing, smart cards, business forms, network business and electronic components, among others. Its products in the electronics field include color filters and other components for LCDs, photomasks, PCBs and semiconductor-related components. In the photomask market DNP is a world leader, utilizing its time honored printing techniques and know-how in the fabrication of cutting- edge photomasks. For more information on DNP, please visit: http://www.dnp.co.jp/eng/

About IMS

IMS Nanofabrication AG (“IMS”) is an Austrian based high-tech company that was founded in December 2006 through the merger of the former IMS Nanofabrication GmbH and IMS – Ionen Mikrofabrikations Systeme GmbH. Based on its extensive know-how in charged particle systems, IMS offers solutions to directly transfer custom designed patterns to resist or to generate resist-less two and three dimensional surface modifications with features below 20 nanometers. IMS focuses its efforts on the development and production of key tool components for mask writing and direct write lithography applications. It plans to commercialize its technology and related services in cooperation with the strategic investors participating in this funding round and with other parties involved in the mask and lithography ecosystem.

About Intel

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Intel is a trademark of Intel Corporation in the United States and other countries.
Additional information about Intel is available at newsroom.intel.com and blogs.intel.com

About Photronics

Photronics Inc. is a leading worldwide manufacturer of photomasks. Photomasks are high precision quartz plates that contain microscopic images of electronic circuits. A key element in the manufacture of semiconductors and flat panel displays, photomasks are used to transfer circuit patterns onto semiconductor wafers and flat panel substrates during the fabrication of integrated circuits, a variety of flat panel displays and, to a lesser extent, other types of electrical and optical components. They are produced in accordance with product designs provided by customers at strategically located manufacturing facilities in Asia, Europe, and North America. Additional information on the Company can be accessed at: http://www.photronics.com


Contact:
IMS Nanofabrication AG
Dr. Hans Loeschner
+43 699 123 67 223


December 7, 2011
Funding Round with INTEL CAPITAL and PHOTRONICS


IMS NANOFABRICATION ANNOUNCES EQUITY FUNDING ROUND WITH

INTEL CAPITAL AND PHOTRONICS


VIENNA, AUSTRIA (DECEMBER 7, 2011) – IMS Nanofabrication AG  an innovator in nanometer scale mask and direct write lithography imaging technology for semiconductor manufacturing applications, today announced that it has signed an equity funding round with participation from Intel Capital, Photronics Inc. and private investor groups.
“We are pleased to announce the funding support being provided by Intel Capital, Photronics and our existing investor groups as we work to commercialize our electron multi-beam mask exposure tool (eMET) for sub 22nm mask writing applications,” said Max Bayerl, CEO of IMS. “The additional resources will help IMS to demonstrate a 256 thousand e-beam mask writer column with initial exposures by the end of 2011.” Technical feasibility for the eMET platform concept was established via work completed under a proof of writing strategy (POWS) program completed earlier in 2011.
“Intel Capital is pleased to support the innovation in electron multi-beam patterning being driven by IMS,” said Keith Larson, vice president, Intel Capital. “Successful demonstration of an electron multi-beam mask writer column would be a significant step forward in addressing industry needs for higher productivity mask writing capability at finer levels of resolution.”
Photronics is joining the equity round to support the development of technology that allows it to provide leading edge mask production capability to its customers. Christopher Progler, Chief Technology Officer, Photronics, said, “Our investment in IMS demonstrates our commitment to invest in technologies that can keep Photronics on the cutting edge of mask writing technology.”
The equity funding will be used to complete an electron multi-beam mask exposure tool proof-of-concept (eMET POC ) to support tool characterization, column optimization and infrastructure enhancements that set the stage for commercialization. Additional terms of the transaction are not being disclosed. The equity funding agreement is subject to satisfaction of customary closing conditions with closing expected to occur by the end of 2011.

About IMS

IMS Nanofabrication AG (“IMS”) is an Austrian based high-tech company that was founded in December 2006 through the merger of the former IMS Nanofabrication GmbH and IMS – Ionen Mikrofabrikations Systeme GmbH. Based on its extensive know-how in charged particle systems, IMS offers solutions to directly transfer custom designed patterns to resist or to generate resist-less two and three dimensional surface modifications with features below 20 nanometers. IMS focuses its efforts on the development and production of key tool components for mask writing and direct write lithography applications. It plans to commercialize its technology and related services in cooperation with the strategic investors participating in this funding round and with other parties involved in the mask and lithography ecosystem.

About Intel Capital

Intel Capital, Intel’s global investment and M&A organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, mobility, health, consumer Internet, digital media, semiconductor manufacturing and cleantech. Since 1991, Intel Capital has invested more than US$10.4 billion in over 1,185 companies in 51 countries. In that timeframe, 194 portfolio companies have gone public on various exchanges around the world and 286 were acquired or participated in a merger. In 2010, Intel Capital invested US$327 million in 119 investments with approximately 44 percent of funds invested outside the U.S. and Canada. For more information on Intel Capital and its differentiated advantages, visit www.intelcapital.com.

About Photronics, Inc.

Photronics is a leading worldwide manufacturer of photomasks. Photomasks are high precision quartz plates that contain microscopic images of electronic circuits. A key element in the manufacture of semiconductors and flat panel displays, photomasks are used to transfer circuit patterns onto semiconductor wafers and flat panel substrates during the fabrication of integrated circuits, a variety of flat panel displays and, to a lesser extent, other types of electrical and optical components. They are produced in accordance with product designs provided by customers at strategically located manufacturing facilities in Asia, Europe, and North America. Additional information on the Company can be accessed at www.photronics.com.

Link: www.businesswire.com/news/


Contact:
IMS Nanofabrication AG
Dr. Hans Loeschner
+43 699 123 67 223


July 12, 2011
“Beam On” of eMET proof-of-concept Tool

“Beam On” has been achieved for the completed proof-of-concept 50keV electron multibeam Mask Exposure Tool (eMET POC). The novel electron-optical column providing 200x reduction works as planned. First eMET POC results will be presented Sept 21 at the SPIE Photomask Technology BACUS 2011 international conference, Monterey, California.

“This is a major step towards achieving our goal of having a very competitive mask writer ready for insertion at the 11nm HP node”, comments Hans Loeschner (CSO / technical Marketing).


September 14, 2010
Proof-of-Writing-Strategy (POWS)

Proof-of-Writing-Strategy (POWS) demonstrating dynamic IMS multi-beam projection writing with 20nm resolution on 6” mask blanks on a moving stage. Results were presented at the SPIE Photomask Technology BACUS 2010 international conference.